? semiconductor components industries, llc, 2011 june, 2011 ? rev. 1 1 publication order number: nz9f2v4s/d nz9f2v4st5g series zener voltage regulators 200 mw sod ? 923 surface mount this series of zener diodes is packaged in a sod ? 923 surface mount package. they are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. they are well suited for applications such as cellular phones, hand held portables, and high density pc boards. specification features ? standard zener breakdown voltage range ? 2.4 v to 18 v ? steady state power rating of 200 mw ? small body outline dimensions: 0.039 x 0.024 (1.00 mm x 0.60 mm) ? low body height: 0.016 (0.40 mm) ? esd rating of class 3 (>16 kv) per human body model ? tight tolerance v z ? these are pb ? free devices mechanical characteristics case: void-free, transfer-molded, thermosetting plastic epoxy meets ul 94, v ? 0 lead finish: 100% matte sn (tin) mounting position: any qualified max reflow temperature: 260 c device meets msl 1 requirements maximum ratings rating symbol max unit total device dissipation fr ? 5 board, (note 1) @ t a = 25 c derate above 25 c p d 250 2.0 mw mw/ c thermal resistance from junction ? to ? ambient r ja 500 c/w junction and storage temperature range t j , t stg ? 65 to +150 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. 1. fr ? 4 minimum pad. 1 cathode 2 anode see specific marking information in the device marking column of the electrical characteristics table on page 3 of this data sheet. device marking information http://onsemi.com device package shipping ? ordering information nz9fxxxst5g sod ? 923 (pb ? free) 8000/tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. sod ? 923 case 514ab x = specific device code m = month code = pb ? free package (note: microdot may be in either location) marking diagram x m 1 2 12
nz9f2v4st5g series http://onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted, v f = 0.9 v max. @ i f = 10 ma for all types) symbol parameter v z reverse zener voltage @ i zt i zt reverse current z zt maximum zener impedance @ i zt i zk reverse current z zk maximum zener impedance @ i zk i r reverse leakage current @ v r v r reverse voltage i f forward current v f forward voltage @ i f v z maximum temperature coefficient of v z c max. capacitance @v r = 0 and f = 1 mhz i f v i i r i zt v r v z v f figure 1. zener voltage regulator temperature ( c) 25 0 100 40 20 0 power dissipation (%) 50 75 100 125 150 80 60 figure 2. steady state power derating
nz9f2v4st5g series http://onsemi.com 3 electrical characteristics (v f = 0.9 max @ i f = 10 ma for all types) device device marking zener voltage vz test current izt ma z zt i z = izt @ 10% mod max z zk i z = 1.0 ma max i zk ma max ir @ vr d vz /dt (mv/k) @ i zt1 = 5 ma cpf max @ v r = 0 f = 1 mhz min max a v min max nz9f2v4st5g 2* 2.43 2.63 5 100 1000 1 50 1 ? 3.5 0 210 nz9f2v7st5g 3* 2.67 2.91 5 100 1000 1 20 1 ? 3.5 0 210 nz9f3v0st5g 4* 2.94 3.26 5 100 1000 1 10 1 ? 3.5 0 210 nz9f3v3st5g 5* 3.32 3.53 5 100 1000 1 10 1 ? 3.5 0 210 nz9f3v6st5g 6* 3.6 3.85 5 100 1000 1 10 1 ? 3.5 0 210 nz9f3v9st5g a** 3.89 4.16 5 100 1000 1 5 1 ? 3.5 ? 2.5 210 nz9f4v3st5g d** 4.17 4.43 5 100 1000 1 5 1 ? 3.5 0 210 nz9f4v7st5g e** 4.55 4.75 5 100 800 0.5 2 1 ? 3.5 0.2 150 nz9f5v1st5g f** 4.989 5.2 5 80 500 0.5 2 1.5 ? 2.7 1.2 130 nz9f5v6st5g j** 5.49 5.73 5 60 200 0.5 1 2.5 ? 2.0 2.5 115 nz9f6v2st5g k** 6.06 6.33 5 60 100 0.5 1 3 0.4 3.7 110 nz9f6v8st5g l** 6.65 6.93 5 40 60 0.5 0.5 3.5 1.2 4.5 105 NZ9F7V5ST5G p** 7.28 7.6 5 30 60 0.5 0.5 4 2.5 5.3 100 nz9f8v2st5g q** 8.02 8.36 5 30 60 0.5 0.5 5 3.2 6.2 90 nz9f9v1st5g r** 8.85 9.23 5 30 60 0.5 0.5 6 3.8 7 80 nz9f10vst5g t** 9.77 10.21 5 30 60 0.5 0.1 7 4.5 8 80 nz9f11vst5g v** 10.76 11.22 5 30 60 0.5 0.1 8 5.4 9 80 nz9f12vst5g y** 11.74 12.24 5 30 80 0.5 0.1 9 6 10 80 nz9f13vst5g 2** 12.91 13.49 5 37 80 0.5 0.1 10 7 11 75 nz9f15vst5g 3** 14.34 14.98 5 42 80 0.5 0.1 11 9.2 13 70 nz9f16vst5g 4** 15.85 16.51 5 50 80 0.5 0.1 12 10.4 14 65 nz9f18vst5g 5** 17.56 18.35 5 50 80 0.5 0.1 14 12.4 16 60 *rotated 90 . **rotated 180 .
nz9f2v4st5g series http://onsemi.com 4 package dimensions sod ? 923 case 514ab ? 01 issue b 0.40 0.30 0.90 dimensions: millimeters *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. dim min nom max millimeters a 0.34 0.37 0.40 b 0.15 0.20 0.25 c 0.07 0.12 0.17 d 0.75 0.80 0.85 e 0.55 0.60 0.65 0.95 1.00 1.05 l 0.05 0.10 0.15 h e 0.013 0.015 0.016 0.006 0.008 0.010 0.003 0.005 0.007 0.030 0.031 0.033 0.022 0.024 0.026 0.037 0.039 0.041 0.002 0.004 0.006 min nom max inches d e b c a l 2x ? y ? ? x ? 0.08 (0.0032) xy h e 2 1 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. nz9f2v4s/d publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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